Infineon’s ENDOPACK Cell embeds 1,200 V SiC MOSFETs in traction inverter PCBs
Infineon Technologies has introduced ENDOPACK Cell, which embeds its 1,200 V Automotive Gen2p CoolSiC MOSFETs directly in a printed circuit board (PCB). ENDOPACK Cell is designed to help automakers develop traction inverters faster and scale them across vehicle platforms. ENDOPACK is Infineon’s new brand for chip-embedding technologies in a rangeContinue Reading












