Indalloy®301 LT: Revolutionizing Power Module Package-Attach Soldering

Sponsored by Indium Corporation In the ever-evolving landscape of electronics manufacturing, innovation is the key to staying ahead. Indium Corporation® , a leading player in the industry, has once again demonstrated its commitment to advancement with the introduction of Indalloy®301 LT. This novel alloy technology is specifically designed for power module package-attach applications and enables lower processing temperatures in preform soldering.  Quest for Lower Processing Temperatures One of the most, Read More